This paper defines a method to measure the chip die pad capacitance using time delay reflectometry (TDR). This method is useful for measuring the low-value capacitance that is present at the end of a ...

In today’s high-speed digital designs, signal-integrity issues such as reflections, excessive losses, and crosstalk can degrade system performance. There are techniques through the use of time-domain ...

The transition of the electronics industry to serial data standards and the need for larger amounts of data to be carried by the computer, communications, and consumer device interconnect links have ...