Earlier this month, Microchip Technology released its BZPACK mSiC power modules, engineered to exceed stringent HV-H3TRB reliability standards for demanding industrial and renewable energy ...

Power modules handle heat, moisture, and high voltage while making design easier and reducing failures. Learn more about ...

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC ® power modules , designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The ...

The latest PV Reliability Workshop highlighted why investing in PV reliability and quality is more important than ever.

Designed to deliver fast, efficient ORing functionality in applications requiring power supply redundancy or parallel ...

The unit measures 2 × 4 × 0.75 inches and delivers a power density of 33 W/in³, enabling significant miniaturization compared ...

Apex Microtechnology has announced the release of the MSA303, the latest member to its family of integrated power modules. The module utilizes silicon carbide MOSFET technology to improve efficiency ...

JinkoSolar has globally launched its new AIDC modules for data centers. Built on the proven Tiger Neo 3.0 TOPCon platform technology, this product is specifically designed for conventional data ...

Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" explores the growing power module packaging materials market, driven by the rise of SiC and GaN semiconductors and electric vehicles.

ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT ...

The collaboration addresses one of the most significant challenges in large-scale electrification: reducing energy losses and ...

Arista Networks this week announced that it has developed a 12.8 Tbps liquid cooled optics module that it says will help address the power and performance needed for AI data center network development ...