Among the most significant gatherings for the photopolymerization industry is the RadTech UV+EB Technology Expo & Conference in the United States. This event serves as a central hub for professionals ...
Offering an impressive throughput of 12.8 Tbps, the Eoptolink XPO features 64 lanes operating at 200 Gbps, achieving a record-breaking front-panel density of 204.8 Tbps within a compact 4-RU rack.
AI data centers are starting to replace copper with co-packaged optics in an effort to reduce energy consumed per bit and ...
For more than 30 years, Adeia has pioneered structure, process and materials-level innovations that have become essential to advanced semiconductor products. The company’s IP is broadly licensed ...
The 3.2T DR8 PIC with 448G EAMs delivers clear benefits in power efficiency, cost, and time to production.”— Dr. Adam ...
Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler ...
In an interview with pv magazine, Empa scientist Mirjana Dimitrievska explains that the CIGS photovoltaic technology, while promising for efficiency and flexible applications, faces persistent ...
Infineon gives vertical power delivery a push with a new generation of multiphase power modules that can be tucked underneath ...
FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...
Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH. This strategic integration unites Kurtz ...
Kaynes Semicon, the semiconductor assembly and test arm of Kaynes Technology India Ltd., has adopted engineering simulation software from Synopsys to strengthen its outsourced semiconductor assembly ...
The Lepton XDS pairs a 160 × 120 radiometric Lepton 3.5 micro‑thermal camera with a five‑megapixel (MP) visible sensor, featuring MSX that enhances thermal imagery in real time by embossing ...
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