As a provider of advanced materials solutions for power device packaging, Indium Corporation will feature its lineup of high-reliability products at APEC 2026, March 22 to March 26, in San Antonio, ...

Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now coming into focus. AI and HPC designs are growing larger ...

Nebraska engineer Jun Wang develops a high-voltage LincolnPak module to cut data center power losses, aiming for more ...

(Matrix PT), headquartered in the innovation hub of Shenzhen, is at the forefront of this transformation, providing ...

Lumentum Holdings Inc. ("Lumentum"), a global leader in photonic solutions, today announced its showcase of technology and product demonstrations designed to meet the accelerating demands of ...

Full suite of products from ACC to FRO Our 1.6T solutions are designed to help customers scale bandwidth while ...

Another selection of significant announcements from the optical communications expo in Los Angeles.

This solution reflects Genuine Optics’ strength in next-generation optical interconnects”— Genuine Optics CEO Madhav ...

The chiplets design combines IP access, interposer expertise, and relationships with HBM suppliers, foundries and OSATs ...

Pronics Announces a SiPh Packaging and Assembly Manufacturing Line for Next Generation AI Optical Circuit Switches at Fabrinet ...

Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced it will showcase breakthrough innovations powering the next generation of AI-driven datacenter and communications networks at ...

Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced it will demonstrate multiple co-packaged optics (CPO) technologies at OFC 2026 in Los Angeles, highlighting the company’s ...