A research team led by Lee Hyun Jun and Noh Hee Yeon from the Division of Nanotechnology at DGIST has succeeded in ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

The interaction of generative AI, agentic AI and machine learning across different areas of an organization holds the greatest promise for optimizing talent. AI can help bridge manufacturing workforce ...

Raemin Wang, Vice President, Segment Marketing at Lattice Semiconductor on small, low power FPGA enabling physical AI.

As AI systems continue to scale and process nodes shrink further, SDC will only become more prevalent. The OCP whitepaper makes clear that traditional approaches to mitigating SDC are insufficient for ...

A team led by engineers at the University of California San Diego has developed a new brain-inspired hardware platform that could help computer hardware keep pace with the explosive growth of ...

Hidden semiconductor defects often pass inspection but fail later in operation. Learn how latent defects form, evade ...

Fuse EDA AI Agent builds upon Siemens' Fuse (TM) EDA AI system, which features a sophisticated RAG pipeline, a multimodal EDA-specific data lake, specialized parsers for EDA file formats, customizable ...

Memories.ai is building a large visual memory model that can index and retrieve video-recorded memories for physical AI.

Nordic Semiconductor, a provider of low-power wireless connectivity solutions, revealed Nordic Fuel Gauge v2.0, a major ...

Absolics says its facility can currently produce a maximum of 12,000 square meters of glass panels a year. That’s enough, Lee ...