Menlo Microsystems and Rosenberger have announced a strategic partnership to co‑develop an ultra‑low‑power cryogenic switch module aimed at improving the scalability of quantum computing systems. The ...

This battery-powered, 2.4-GHz ISM-band transceiver uses DSSS modulation to achieve a wireless communications range as great as 300 m.

Rosenberger are collaborating on a multichannel ultra-low power switch module designed to accelerate scalable quantum systems. The partnership combines Menlo Micro’s Ideal Switch ...

Semiconductor PLI is reshaping industry supply chains, enabling reliable chip access, lower costs and faster deployment for telecom networks and digital infrastructure.

Mobile World Congress 2026 in Barcelona brought together semiconductor vendors, wireless infrastructure companies, and test-and-measurement suppliers to present new hardware platforms, chipsets, and ...

As IoT 2.0 brings edge AI, real-time coordination, and constant data streams into residential environments, the challenge becomes the creation of a scalable, secure wireless ...

Tata Electronics will manufacture Qualcomm's automotive system-in-package modules in Assam, with the partnership focused on ...

Kepler Communications today announced the commissioning of distributed on-orbit computing across its Tranche 1 optical data relay constellation, the world’s first commercially operational optical data ...

Teledyne Technologies (NYSE:TDY) released a new Wideband Limiter for electronic warfare applications, designed to protect systems from high power RF and directed energy threats. Teledyne FLIR Defense ...

Issued on behalf of VisionWave Holdings, Inc.Companies mentioned in this article: VisionWave Holdings (NASDAQ: VWAV), First Solar (NASDAQ: ...

The automotive Wi-Fi modules market is poised for growth driven by demand for connected infotainment, IoT integration, and ...

The CQM211 5G NR Advanced module is designed to meet the demands of high-bandwidth industrial IoT applications, offering multi-gigabit throughput, in-built GNSS, and flexible form factors for seamless ...