“Our customers are highly motivated to continue to extend optical inline defect inspection beyond the 20nm node,” said Keith Wells, vice president and general manager of the Wafer Inspection (WIN) ...
HEIDELBERG, Germany — April 25, 2017 — The print media industry frequently faces demands for high quality in combination with ever shorter throughput times, complex products, or just-in-time ...
MILPITAS, Calif., July 20, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the revolutionary eSL10™ e-beam patterned-wafer defect inspection system. The new system is designed to ...
Chipmakers are ramping new tools and methodologies to achieve sufficient yield faster, despite smaller device dimensions, a growing number of systematic defects, immense data volumes, and massive ...
A technical paper titled “In situ electrical property quantification of memory devices by modulated electron microscopy” was published by researchers at Hitachi High-Tech Corporation, KIOXIA ...
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