Infineon Technologies shares rose more than 3% on Friday after J.P. Morgan upgraded the German chipmaker to “overweight” from ...

The demand for higher power levels in artificial intelligence (AI) servers continues to grow, creating new challenges for manufacturers. To address this need, Infineon Technologies AG is expanding its ...

Infineon has introduced two new high-voltage Intermediate Bus Converter (HV IBC) reference designs to help customers move to AI server power architectures powered by +/-400 V and ...

Munich, Germany –17 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its voltage regulation (VR) solutions portfolio for DC-DC conversions in AI data centers with two new ...

Wolfspeed is pleased to announce the appointment of Daihui Yu as regional president for Greater China, effective March 16, 2026. In this key leadership position, Yu will oversee the expansion of the ...

Apex Microtechnology has announced the release of the MSA303, the latest member to its family of integrated power modules. The module utilizes silicon carbide MOSFET technology to improve efficiency ...

Infineon’s XDPE1E multiphase PWM buck controllers and TDA49720/12/06 PMBus POL regulators streamline voltage regulation in AI ...

By Nathan Vifflin SOPOT, Poland, March 17 (Reuters) - Europe's semiconductor industry must invest in more automated and larger 300-millimeter wafer fabs to counter growing competition from Chinese ...

Microchip Technology (Nasdaq: MCHP) today announces its BZPACK mSiC ® power modules , designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. The ...

ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT ...

According to the latest study published by MarkNtel Advisors, the Global Silicon Carbide Market is projected to grow at a CAGR of around 27.12% during 2026–2032. The market expansion is primarily ...

Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on display along with those based on standards like COM Express. More boards and ...