In the age of Industry 4.0, manufacturers are expected to develop increasingly sophisticated, digitally integrated products ...
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{"meta":{"app":"FEATool Multiphysics","author":"Precise Simulation","build":"1.9.0","date":"19-Feb-2020","descr":["This is an example of modeling anisotropic heat ...
Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...
Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
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