Increased efficiency and flexibility are two increasingly desirable qualities of photovoltaics, and the implementation of new materials and form factors could reshape the landscape of solar energy.

Graphene and advanced coatings are two of the subject matters explored in IDTechEx's extensive portfolio of Advanced Materials & Critical Minerals Research Reports, given their role within some of the ...

DP Patterning AB was founded in 2013 and is a spin-off from the Swedish Research Institute, RISE. Driven by science, innovation and research, they develop products that turn the manufacturing of ...

Take-out in boxes fermented from bacteria, ketchup squeezed from seaweed, oil spills cleaned with aerogels derived from wood pulp- these seeming technologies of the future are already being ...

The EV revolution is driving demand for a huge variety of materials used in battery cells and packs. With new chemistries emerging to bridge cost and energy density gaps, the landscape is evolving ...

IDTechEx analyst Dr Conor O'Brien covers the outlook for graphene through to 2036. IDTechEx has conducted market research on graphene for over ten years. The new report Graphene & 2D Materials ...

When it comes to history and awareness, polymer additive manufacturing leads the 3D printing industry. The first type of 3D printing to be invented in the 1980s was stereolithography, while ...

The sleekening and thinning down of electronics is a trend that isn't expected to leave any time soon, as miniaturization, seamlessness, and ease of use continue to be driving factors behind the ...

A new wave of electronics manufacturing is on the horizon, driven forward by volatile energy prices and increasing demand for sustainability. With the electronics industry accounting for 4% of global ...

In the rapidly evolving semiconductor industry, chiplet technology is emerging as a transformative force, offering innovative solutions to many of the challenges faced by traditional monolithic System ...

Semiconductor packaging has progressed from 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving single micronmeter level interconnecting pitches and over 1000 GB/s bandwidth.

At the 12th IDTechEx Printed Electronics Europe conference and exhibition, four companies were awarded for their great achievement in developing and commercializing printed electronics technologies.