Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leading hardware companies Vinci today announced the ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Hardware-in-the-loop (HiL) refers to testing a component while embedding it in one or more of its likely environments. These environments are represented virtually by computer models. The tested ...

“Addressing complex engineering challenges such as developing products that are more powerful, yet greener, lighter yet stronger requires a fully-integrated CAE solution,” said Jean-Claude Ercolanelli ...

Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...

Consider the inside of a typical wind turbine nacelle. It will contain a gearbox, electrical controls, a generator, hub mounting, blade controls, and several other major systems. In the case of ...

Cambashi reviews the mechanical CAE and simulation market, highlighting AI innovation, major acquisitions, and growth ...

Vinci today announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under ...

Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leading hardware companies Building on its ...