ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance ...
TORONTO, Aug. 12, 2025 /PRNewswire/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing ...
Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...
Advances in laser grooving means that manufacturers are able to optimize die separation quality by combining traditional blade dicing and laser grooving techniques to separate individual chips from ...
Cleaving is a fast and simple method used for preparing samples of semiconductor materials, including silicon. In contrast, sapphire does not cleave well, despite being a single crystal. While sawing ...
TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
The wafer dicing process, a critical stage in semiconductor production, involves the precise cutting of silicon wafers into individual die components, which are essential in a wide range of electronic ...
Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...
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