Santa Cruz, Calif. – Claiming to document a major step forward in system-on-chip design, STMicroelectronics engineers are writing a book about the SystemC transaction-level modeling the European ...

Thame, U.K. -- February 13, 2009-- Open Virtual Platforms (OVP) today released new native SystemC transaction level modeling (TLM)-2.0 technology to use with OVP CPU models that run to the speed of ...

SAN JOSE, Calif.--(BUSINESS WIRE)--June 6, 2005--The Open SystemC Initiative (OSCI) today announced the delivery of the SystemC(TM) Transaction-level Modeling (TLM) Standard 1.0. The availability of a ...

SystemC standards group Open SystemC Initiative (OSCI) has released the SystemC TLM (transaction-level modeling) standard version 1.0. The TLM standard kit, which can be downloaded under an open ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest professional association advancing technology for humanity, today announced that the IEEE Standards Association (IEEE-SA) Standards Board ...

THAME, England--(BUSINESS WIRE)--The Open Virtual Platforms (OVP) initiative (www.OVPworld.org) has announced the release of a reference virtual platform of the ARM Integrator development board using ...

MOUNTAIN VIEW, USA: Synopsys Inc. has announced support for the newly ratified Open SystemC Initiative (OSCI) SystemC TLM-2.0 standard in its Innovator and DesignWare System-Level Library products.

The last several years have seen strong adoption of transaction-level models using SystemC TLM 2.0. Those models are used for software validation and virtual prototyping. For functional verification, ...

The Open SystemC Initiative (OSCI) has delivered its Draft SystemC Transaction-Level Modeling (TLM) 2.0 kit, containing proposed extensions to OSCI TLM application programming interface (API) ...

System-Level Design moderated a discussion about the future of SystemC with Thomas Alsop, corporate design solution expert at Intel; Ambar Sarkar, chief verification technologist at Paradigm Works; ...