South Koreas SK Hynix is accelerating its push into the artificial intelligence semiconductor market with a major new ...

Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National ...

Intel's (INTC) former CEO Pat Gelsinger is joining the board of directors for Syenta, an Australia-based semiconductor ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by the ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

The heterogeneous integration packaging solutions unit of 3D Glass Solutions marks a significant capability leap in advanced ...

Onto Innovation Inc. (NYSE: ONTO) ("Onto Innovation" or the "Company") today announced a strategic collaboration with X-ray technology leader Rigaku Holdings Corporation to advance next-generation ...

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...