EDN

Semiconductor characterization software adds parallel test, parametric die sort features

Cleveland, Ohio — Keithley Instruments, Inc. has announced the availability of its Automated Characterization Suite (ACS) V3.2 software for semiconductor test and characterization at the device, wafer ...
Electronic Design

Dynamically Testing WBG Power Semiconductors Down to the Die

Double-pulse testing will play a pivotal role in the future of power electronics. Power designers and system engineers rely on it to evaluate the switching characteristics of power semiconductors such ...
TMCnet

Modus Test Partners with yieldWerx to Deliver Closed-Loop Socket to Silicon Correlation

yieldWerx provides a semiconductor yield management platform that enables manufacturers to collect, analyze, and act on production data across the manufacturing lifecycle. The platform consolidates ...
EDN

A real-world approach for AI-driven semiconductor manufacturing

Combine scalable analytics with advanced AI capabilities like LLMs and agentic tasks to create a new chipmaking platform.
Semiconductor Engineering

Semiconductor Test Faces Technology Shifts In The AI Era

The surge in data-rich applications shows no signs of slowing down, fueling significant evolution within the global semiconductor industry. This insatiable demand for data necessitates a comprehensive ...
Nasdaq

Silicon Carbide Semiconductor Supplier Selects Aehr FOX System for Wafer Level Test and Burn-in of Silicon Carbide Devices for Automotive Electric Vehicles

FREMONT, CA / ACCESSWIRE / January 25, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announced that a new ...
Semiconductor Engineering

Harnessing The Power Of Data In Semiconductor Test

Every day, new methods are being developed to harvest, cleanse, integrate, and analyze data sources and extract from them useful, actionable intelligence to aid decision-making and other processes.
Digi Times

ADLINK high-efficiency die sorting machine solution increases effectiveness of IC packaging and testing

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...
Yahoo Finance

Burn-In Test System for Semiconductor Market Size to Grow $1530.25 Million by 2033 | SNS Insider

Austin, Jan. 13, 2026 (GLOBE NEWSWIRE) -- Burn-in Test System for Semiconductor Market Size & Growth Insights: According to the SNS Insider, “The Burn-In Test System for Semiconductor Market size was ...
Yahoo Finance

FPT announces the establishment of an Advanced Semiconductor Testing and Packaging plant, accelerating the integration of Vietnam's Semiconductor value chain

HANOI, Vietnam, Jan. 29, 2026 /PRNewswire/ --On January 28, 2026, in Hanoi, FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming ...
AZOM

A Closer Look at Semiconductor Test Equipment

During standardized chip fabrication, integrate circuit (IC) testing is conducted repeatedly to inspect the chips once they are manufactured. IC testing begins with wafer penetration before etched ...