Vacuum reflow soldering technology, although limited in adoption, is emerging as a key focus in high-reliability electronics. While traditional reflow ...

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...

In our previous issues in this series on making circuit boards, we covered placing solder paste and placing components. Now it’s time to bake our cake! There are a variety of methods for reflowing a ...

Ever since automated optical inspection (AOI) became a mainstay of a manufacturer's test strategy, planners have debated where to place it in the production process. Do you inspect the solder paste ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

A new 16-zone reflow oven configuration by Kurtz Ersa  is positioning itself as a high-performance option for electronics manufacturers seeking tighter ...