Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...
Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.
Ultra-thin and energy efficient displays that use organic compounds to emit light have been stirring up excitement in the consumer electronics industry for several years. Researchers have now ...
SCOTTSDALE, Ariz.--(BUSINESS WIRE)--N2 Packaging Systems, LLC (“N2 Packaging”) is the holder of various patents within the United States, Canada and other international markets relating to its ...
A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has ...
Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...
Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...
WEST LAFAYETTE, Ind. – Purdue University researchers have developed a large-scale manufacturing process that may change the way some grocery store foods are packaged. According to Credence Research, ...
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