The new HBM4E Controller builds on Rambus’s track record of more than 100 HBM design wins and the company’s long-standing ...
Memory systems have evolved a lot in the previous few years due to advancements in fabrication technology. High Bandwidth Memory (HBM) is an example of the latest kind of memory chips which can ...
SUNNYVALE, Calif., May 21, 2008 – Denali Software, Inc., today, as one of the DDR PHY Interface (DFI) specification participating members including ARM, Denali, Intel, and Samsung, announced the ...
PISCATAWAY, N.J.--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced a major update ...
In September, Rambus announced the achievement of reaching 4 gigabits per second (Gbps) operation with our HBM2E memory interface. This milestone was demonstrated in silicon and required mastering ...
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its highly anticipated JESD220H and ...
TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced sampling [1] of the industry’s first [2] Universal Flash Storage [3] (UFS) embedded flash memory devices ...
The physical layer interface is necessary for a chip to access the outside world, but it threatens to consume increasing portions of the power budget. What can be done to prevent a PHY limit? Physics ...
SUNNYVALE, Calif. — September 05, 2006 - eSilicon Corporation, a leading supplier of custom integrated circuits (ICs), today announced it is offering complete, customized Double-Data Rate 2 (DDR2) ...
High-speed-digital serial I/O links and DDR memory interfaces are presenting significant measurement challenges as fourth-generation standards emerge. As signals travel at ever higher speeds over ...
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