Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
This technical FAQ examines three modeling gaps identified in engineering literature and outlines algorithmic methods to address them.
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...
Though the term mechatronics was coined back in 1969, it is still tough to find easy-to-use electromechanical design tools that enable design optimization across engineering disciplines. Few machine ...
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