QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

How IP-XACT enables tool interoperability, multi-level abstraction, and accurate hardware/software interface alignment through structured metadata. Why integration automation is critical as complexity ...

A single breakthrough won’t define the future of electronic devices. Trailblazers must combine innovative engineering and ...

A key discussion earlier this year at the Hot Chips conference was using AI for semiconductor chip development. Some felt that AI should be integrated into the electronic design automation (EDA) tools ...

New and repurposed fabrication techniques for flexible electronic devices are proliferating rapidly. Some may wonder if they are better than traditional methods and at what point they’ll be ...

As data speeds push into the multi-gigabit range and requirements on digital systems grow more complex, cutting down the time-to-market while also ensuring error-free reliable designs seems impossible ...

Future Electronics, a global distributor of electronic components, and SnapMagic, a provider of CAD models and design ...