Using a fine copper termination construction process and featuring land-grid array terminations, the LGA Decoupling Capacitor reduces internal inductance by 50% compared with capacitors using more ...
This paper covers technological advances on ultra low profile silicon capacitors for embedded applications and System in Package modules. It also presents a novel approach to design high density PICS® ...
From MQTT and HMIs to digital twins, IoT app connectivity and the EdgeX Foundry, the concept of decoupling software from hardware is quickly moving to the forefront of automation technology ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results