Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® ...

Molex has expanded its Co-Packaged Optics (CPO) interconnect toolkit designed to eliminate the most critical bottlenecks in AI cluster scaling. Additionally, Molex has introduced the High-Radix ...

Offering an impressive throughput of 12.8 Tbps, the Eoptolink XPO features 64 lanes operating at 200 Gbps, achieving a record-breaking front-panel density of 204.8 Tbps within a compact 4-RU rack.

Earlier in March 2026, MACOM Technology Solutions Inc. used the OFC 2026 conference to showcase a wide range of high-speed photonics, optoelectronic and copper interconnect solutions for AI, cloud and ...

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced a major expansion of its 1.6T optical DSP platform portfolio, advancing the industry's ...

Keysight Technologies, Inc. (NYSE: KEYS) today introduced the Functional Interconnect Test Solutions (FITS) portfolio and ...

Keysight Technologies launched updates to its test solution designed to aid validation of next-generation electrical and ...

According to Dell’Oro Group, data center interconnect accounted for the most bandwidth growth over the past year, driven by large deployments from cloud providers. This trend is expected to continue ...

By Jaspreet Singh March 5 (Reuters) - Marvell Technology forecast fiscal 2028 revenue above Wall Street estimates on Thursday ...

Corning Incorporated GLW is advancing its capabilities in high-density data center connectivity by licensing PRIZM TMT optical ferrule technology from US Conec. This initiative expands Corning’s ...

FlexScan FS300-323 1310/1550/1625 model: Offers complete PON testing up to 1:128 ratios with PON dead zones as low as 10 meters. FlexScan FS300-320 1310/1550 model: Offers revolutionary fast testing ...