The Package Thermal Analysis Calculator (PTA) aids in the analysis of the thermal properties of integrated circuit packages. These include thermal resistance, power dissipation, and die, package, and ...

Dielectric thermal analysis (DETA) is a materials science technique in which an oscillating electric field is used to analyze changes in the physical properties of a number of polar materials. This ...

The Thermal Noise Calculator (TNC) aids in the analysis of thermal noise found in resistors and other noise sources. The program is for use with an HP® 50g calculator or free PC emulator. Steve ...

Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of ...

FLIR Systems announces a web page that brings together the opportunity to sign-up for forthcoming free live online tutorials and review recent popular thermal imaging webinars, seminars and events.

Thermal analysis is the study of materials as a function of changing temperature. There are several thermal analysis techniques such as: Thermogravimetric analysis (TGA) which measures weight changes; ...

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...

The Thermal Analysis (VITA) module enables nanoscale thermal analysis (nTA), a novel technique that allows the determination of the local transition temperature on the surface of a material with ...

The semiconductor industry is turning to 3D integrated circuits (3D ICs) to meet increasing demands for high performance, miniaturization and energy efficiency. By stacking dies into 3D assemblies, we ...