A ribbon-cutting ceremony of a new advanced semiconductor research and development center in Union City marks the first such ...

Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National ...

Union City just scored a serious upgrade in the tech world. Japanese materials firm Resonac has opened what industry and ...

CEO Pat Gelsinger joins Syenta’s board as it raises $26M to commercialize AI chip advanced packaging tech—boost bandwidth, ...

Packaging has shifted from a back-end afterthought to the center of Intel's manufacturing strategy as AI workloads push ...

By Stephen Nellis SAN FRANCISCO, April 21 (Reuters) - Syenta, an Australian semiconductor technology startup, said on Tuesday ...

Patent-pending innovations deliver scalable materials building blocks for advanced AI and high-performance computing packaging solutions Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

HBM leadership strengthens against rivals Samsung and Micron. South Korea's SK Hynix will invest 19 trillion won ($12.85 ...

Intel Corp (NASDAQ:INTC, XETRA:INL) shares fell about 4% to around $65 on Wednesday, as analysts at Wedbush cautioned that ...

Advanced packaging is becoming a key driver of semiconductor progress, focusing less on shrinking transistors and more on how components like memory and logic dies are packaged together for ...

Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge ...