- New DSPs offer scalable architecture and dual thread design with support for AI, addressing growing demand for smarter, more efficient wireless infrastructure - High-performance Ceva-XC23 DSP ...

Rohde & Schwarz and LITEON collaborate to showcase a production-optimized test setup for high-throughput multi-device testing ...

Now that we’re getting comfortable with 5G, network operators are already planning for 5G-Advanced, release 18 of the 3GPP standard. The capabilities enabled by this new release—extended reality, ...

Prior collaboration with NVIDIA: Testbed for AI/ML-based neural receiver as seen at MWC Barcelona ...